Advanced EUV Photomask Inspection: RESCAN Tool For High-Throughput Defect Analysis.pdf

BACUS-Newsletter-June-2017.pdf
PDF
🔗 Source: spie.org
📊 Size: 4.47 MB
📄 Pages: 12 pages
⬇️ Downloads: 35

Summary

key points from a publication focusing on photomask technology, specifically regarding extreme ultraviolet (EUV) lithography.

Key Highlights:

- BACUS Group: A dedicated international technical group within SPIE focused on advancing photomask technology.
- RESCAN Tool: Developed at Paul Scherrer Institute (PSI) in collaboration with NuFlare Technology, RESCAN is a defect inspection platform for EUV photomasks using Scanning Scattering Contrast Microscopy (SSCM) and Scanning Coherent Diffraction Imaging (SCDI).
- EUV Lithography Advancements: The text discusses the imminent need for EUV mask metrology infrastructure as EUV lithography prepares for high-volume manufacturing.
- Challenges: Actinic defect inspection of patterned EUV photomasks is crucial but currently lacks a commercial tool.
- Solution Proposed: RESCAN aims to fill this gap with its fast and precise defect detection and localization capabilities.
- Upcoming Conferences: The SPIE Photomask Technology Conference (Monterey, September 11-14) will converge with the EUVL Symposium, offering a unique platform for discussions on EUV lithography challenges, including mask defect management without actinic inspection.
- In-House Projects: PSI is developing compact EUV sources (COSAMI) and advanced pixel detectors (JUNGFRAU) to support stand-alone EUV photomask inspection tools.

Overall, the publication highlights the ongoing efforts to address critical technological gaps for the successful integration of EUV lithography into high-volume manufacturing.

Description

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Technical Information

  • File Format: PDF
  • File Size: 4.47 MB
  • Pages: 12
  • Language: EN
  • Total Downloads: 35
  • Last Updated: 1 week ago

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