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SOT764-1.pdf

SOT764-1.pdf
Preview of SOT764-1
🔗 Source: assets.nexperia.cn
📊 Size: 140 KB
👤 Author: Nexperia BV
⬇️ Downloads: 17

Summary

SOT764-1 is a plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package with 20 terminals, 0.5 mm pitch, and a body size of 4.5 mm x 2.5 mm x 1 mm. The package has a footprint dimension of 5.75 mm x 3.75 mm and a footprint area of 21.56 mm². It is a surface mount package with a JEDEC package outline code of MO-241. The package is suitable for reflow soldering, and the recommended stencil thickness is 0.1 mm. The document provides detailed information on the package outline, soldering, and legal information, including disclaimers, limited warranty, and liability.

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Description

SOT764-1 is a plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package with 20 terminals, 0.5 mm pitch, and a body size of 4.5 mm...

Technical Information

  • File Format: PDF
  • File Size: 140 KB
  • Pages: 5
  • Language: EN
  • Author: Nexperia BV
  • Total Downloads: 17
  • Last Updated: 3 months ago

Document Overview

This PDF document about SOT764-1 provides comprehensive information and guidance. Whether you're a beginner or advanced user, this resource offers valuable insights into SOT764-1.

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SOT764-1 guideSOT764-1 tutorial

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