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The Center for Security and Emerging Technology (CSET) submitted a response to the U.S. Department of Commerce's request for information on supporting a strong domestic semiconductor industry. Key points and recommendations include:

Focus CHIPS Act manufacturing incentives on leading-edge logic, DRAM, and legacy logic chips
Increase advanced packaging facility capacity and supply of advanced packaging equipment in the US
Target research and development that supports innovation in advanced packaging
Consider factors such as potential stipulations about covered entities, eligibility criteria, and relevant bidding categories when reviewing applications for federal financial assistance
Establish facilities such as a national facility for innovative semiconductor tools, a fabrication sandbox, and a dedicated Advanced Packaging facility
Focus funding for advanced packaging innovation on R&D related to chiplets, heterogeneous integration, equipment automation, and wafer-level packaging
Invest in growing the pipeline of American students in semiconductor-relevant graduate programs and facilitate high-skilled immigration of foreign-born workers
Define "semiconductor" for purposes of a semiconductor manufacturing incentives program as a class of electronic devices in which electronic conduction takes place within a semiconductor material.