SOT137-1.pdf

SOT137-1.pdf
Preview of SOT137-1
🔗 Source: assets.nexperia.cn
📊 Size: 246 KB
👤 Author: Nexperia BV
⬇️ Downloads: 40

Summary

The SOT137-1 is a plastic, small outline package with 24 leads, a 1.27 mm pitch, and body dimensions of 15.4 mm x 7.5 mm x 2.65 mm. The package has a footprint of 17 mm x 11.45 mm and a footprint area of 194.65 mm². It is a surface mount package with a seated height of 2.65 mm and a package height of 2.25-2.45 mm. The package outline is defined by various dimensions, including D (15.2-15.6 mm), E (7.4-7.6 mm), and e (1.27 mm). The package is suitable for reflow and wave soldering, with recommended footprint dimensions and solder land patterns provided. The document also includes legal information, disclaimers, and notices regarding the use of the package and Nexperia's products.

Description

The SOT137-1 is a plastic, small outline package with 24 leads, a 1.27 mm pitch, and body dimensions of 15.4 mm x 7.5 mm x 2.65 mm.

Technical Information

  • File Format: PDF
  • File Size: 246 KB
  • Pages: 6
  • Language: EN
  • Author: Nexperia BV
  • Total Downloads: 40
  • Last Updated: 2 months ago

Document Overview

This PDF document about SOT137-1 provides comprehensive information and guidance. Whether you're a beginner or advanced user, this resource offers valuable insights into SOT137-1.

Related Topics

If you're interested in SOT137-1, you might also want to explore:

Download SOT137-1 eBooks for free and learn more about SOT137-1. These books contain exercises and tutorials to improve your practical skills, at all levels!

Not satisfied with this document? We have related documents to SOT137-1, try searching with similar keywords: SOT137-1, Sot137

You can download PDF versions of the user's guide, manuals and ebooks about SOT137-1, you can also find and download for free A free online manual (notices) with beginner and intermediate, Downloads Documentation, You can download PDF files (or DOC and PPT) about SOT137-1 for free, but please respect copyrighted ebooks.