TSMT3MCu Inner Structure.pdf
TSMT3M_Cu_Inner_Structure.pdf
Description
- Direction of wire bonding and die bonding, shape of frame, die size, and number of wires differ by product number.
- Materials:
1.
Technical Information
- File Format: PDF
- File Size: 152 KB
- Pages: 2
- Language: EN
- Author: ROHM Co., Ltd.
- Total Downloads: 153
- Last Updated: 3 weeks ago
Document Overview
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