Innovative Probe Needle Cleaning Techniques.pdf

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Preview of Innovative Probe Needle Cleaning Techniques
🔗 Source: swtest.org
📊 Size: 1.01 MB
👤 Author: Jim Anderson
⬇️ Downloads: 141

Summary

The suspected contaminants causing high contact resistance include:

Aluminum Oxide
Anti-reflectives
Tungsten Oxide
Passivation
Silicon Nitride
Tri-nitrides
Polymers & Fluorocarbons
Lapping media
Electrically activated buildup of dielectrics
Outgassing of packing materials

Compounds containing elements such as Oxygen, Sulfur, Chlorine, Carbon, Nitrogen, Copper, Aluminum, and Silicon were identified as contaminants.

A card is considered "dirty" when it exhibits high contact resistance, yield fallout, or reprobe failure. Cleaning methods used include scrubbing on various materials, dry brushing, wet brushing, and using dish soap and DI water. Abrasion is thought to reduce contact resistance by physically removing contaminants.

Description

The suspected contaminants causing high contact resistance include:

* Aluminum Oxide
* Anti-reflectives
* Tungsten Oxide
* Passivation
* Silicon Nitride
*...

Technical Information

  • File Format: PDF
  • File Size: 1.01 MB
  • Pages: 25
  • Language: EN
  • Author: Jim Anderson
  • Total Downloads: 141
  • Last Updated: 11 hours ago

Document Overview

This PDF document about Innovative Probe Needle Cleaning Techniques provides comprehensive information and guidance. Whether you're a beginner or advanced user, this resource offers valuable insights into Innovative Probe Needle Cleaning Techniques.

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