Signal Integrity Agenda.pdf

Opening Lecture - Nonhomogeneous current distribution in Power Vias by Mr. Dudi Tash
9:30-10:30: Session 1 - Power integrity principles by Dr. Eric Bogatin
10:30-10:45: Break
10:45-11:45: Session 2 - PDN Design by Dr. Eric Bogatin
11:45-13:00: Session 3 - Robust PDN design solutions by Dr. Eric Bogatin
13:00-14:00: Lunch
14:00-14:45: PCB Insertion Loss by Mr. Mike Resso
14:45-15:30: High-speed systems by Dr. Davi Correia
15:30-15:45: Break
15:45-16:45: Conductors' Power Dissipation by Mr. Dror Haviv and Common-Mode Noise Suppression by Mr. Shai Sayfan-Altman
16:45-17:15: Break
17:15-17:30: Closing Speech
Day 2:
8:00-9:00: Registration & Gathering
9:00-9:15: Opening Lecture by Mr. Dudi Tash
9:15-10:00: Radiation Emissions by Dr. Avri Frenkel
10:00-11:00: Incorporating COM into SI analysis by Mr. Cristian Filip
11:00-11:15: Break
11:15-13:00: PCB Material by Mr. Jeff Loyer
13:00-14:00: Lunch
14:00-14:45: Robust De-embedding techniques by Mr. Alex Manukovsky
14:45-15:30: EMC & SI by Mr. Eli Recht
15:30-15:45: Break
15:45-16:15: Testing 25Gbps by Mr. Liav Ben Artsi
16:15-16:45: 100G and 400G Optical Ethernet by Mr. John Calvin
16:45-17:15: Break
17:15-17:30: Closing Speech
Day 3 (DGCON+):
8:30-9:30: Registration & Gathering
9:30-13:00: Boot Camp with Eric Bogatin
13:00-14:00: Lunch
14:00-15:00: Q&A
15:00-15:15: Closing Speech, High-speed serial link boot camp covering S-parameters, channel models, and jitter.