Xilinx Interconnect.pdf

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Preview of Xilinx Interconnect
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📊 Size: 707 KB
👤 Author: Sagheer Ahmad
⬇️ Downloads: 271

Summary

- Multiple FPGA Dies Integration (Virtex-7 2000T) announced in 2011
- Multiple FPGA & HBM Dies (Virtex US+ VU3xP) announced in 2017
- Multiple FPGA & SerDes Chiplets (Virtex-7 H870T) announced in 2012
Motivations for chip-to-chip interconnect ecosystem include integration, disaggregation of monolithic die into chiplets, and lower latency, power, and form factor
Use cases for chiplets include high-bandwidth applications such as HBM, streaming interfaces, and accelerators
Standardization efforts are focused on PHY, including serial (XSR) and parallel (HBI) interfaces, with HBI being a minimally enhanced HBM-compatible interface for chip-to-chip communication.

Description

- Multiple FPGA Dies Integration (Virtex-7 2000T) announced in 2011
- Multiple FPGA & HBM Dies (Virtex US+ VU3xP) announced in 2017
- Multiple FPGA & SerDes...

Technical Information

  • File Format: PDF
  • File Size: 707 KB
  • Pages: 8
  • Language: EN
  • Author: Sagheer Ahmad
  • Total Downloads: 271
  • Last Updated: 4 days ago

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