ATECC608B CryptoAuthentication ™ Device: Secure Key Storage And Cryptographic Processing.pdf

Secure Cryptographic Co-Processor for IoT and Embedded Applications

The ATECC608B is a high-security CryptoAuthentication™ device offering advanced cryptographic capabilities in a compact form factor suitable for resource-constrained environments like IoT devices.

Key Features:

Secure Key Storage: Protects up to 16 keys, certificates, or data using hardware-based encryption.
Hardware Cryptographic Acceleration:
Supports ECDSA (FIPS186-3) and ECDH (FIPS SP800-56A) for secure digital signatures and key agreement.
Implements NIST Standard P256 elliptic curve cryptography.
Provides hardware support for SHA-256 hashing, HMAC, AES-128 encryption/decryption, and Galois Field Multiply for GCM.
Networking Key Management:
Enables turnkey PRF/HKDF calculation for TLS 1.2 & 1.3 protocol security.
Supports ephemeral key generation and key agreement in SRAM for secure communication.
Facilitates small message encryption with keys fully protected.
Secure Boot: Validates ECDSA code signatures, supports optional stored digest/signature, and allows disabling communication keys before boot to enhance security.
High-Quality Random Number Generator (RNG): Utilizes a NIST SP 800-90A/B/C compliant RNG for secure random data generation.
Monotonic Counters: Provides two high-endurance monotonic counters for secure counting and timing operations.
Unique Identification: Features a unique 72-bit serial number for individual device tracking.

Target Applications:

IoT network endpoint key management & exchange
Encryption for small messages and sensitive personal information (PII) data
Secure Boot and protected firmware downloads
Ecosystem control and anti-cloning mechanisms

Interface Options:

High-Speed Single Wire Interface with one GPIO pin
Standard I2C Interface (1 MHz)

Temperature Ranges:

Standard Industrial: -40°C to +85°C
Extended Industrial: -40°C to +100°C

Power Consumption:

Low sleep current: < 150 nA

Package Options:

8-pad UDFN, 8-lead SOIC, and 3-lead Contact packages are available.